EP4CE55F29C8N vs EP4CE55F29I8LN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE55F29C8N sa pamamagitan ng Intel at EP4CE55F29I8LN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE55F29C8N | EP4CE55F29I8LN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Cyclone IV E | Cyclone IV E |
| Logic Elements (LE) | 55,856 | — |
| Embedded Memory | 2,340 Kbits | — |
| Embedded Multiplier Blocks (18x18) | 154 | — |
| Maximum User I/O Pins | 374 | 374 |
| Logic Array Blocks (LABs) | 3,491 | 3,135 |
| Process Technology | 60 nm (TSMC low-power) | 60 nm TSMC low-power |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | 780-ball FBGA (F29) | 780-ball FBGA (F29) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Speed Grade | 8 (commercial) | — |
| Temperature Grade | Commercial (0 C to +85 C) | — |
| PLLs | 4 to 8 (per device) | 4 |
| Configuration Method | SRAM-based, volatile (requires external config device) | — |
| Tindminan RoHS | Compliant | — |
| Lead-Free / Halogen-Free | Yes (per part marking) | — |
| Device Model | — | EP4CE55 |
| Logic Elements (LEs) | — | 55,856 |
| Total Embedded Memory Bits | — | 2,396,160 bits |
| Embedded Memory (M9K blocks) | — | 260 blocks |
| 18x18 Hardware Multipliers | — | 374 |
| Ball Pitch | — | 1.0 mm |
| Temperature na Operasyon | — | -40C to +85C (Industrial) |
| Lead-Free / RoHS | — | Yes (per OPN suffix N) |
| Configuration Modes | — | JTAG, AS, PS, FPP |
| Supported I/O Standards | — | LVTTL, LVCMOS, LVDS, SSTL, HSTL |