EP4CE6E22C6 vs EP4CE6E22C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C6 sa pamamagitan ng Intel at EP4CE6E22C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C6 | EP4CE6E22C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | — |
| Device Logic Elements | 6,272 LE | — |
| Logic Array Blocks (LABs) | 392 LABs | 392 |
| Total RAM Bits | 270 Kbit | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 91 | 91 |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 | C8 (-8 corner) |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | — |
| Package Type | 144-pin EQFP (Enhanced QFP, exposed pad) | — |
| Package Dimensions | 22 mm × 22 mm | — |
| Lead Pitch | 0.5 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | TSMC 60 nm low-k | 60 nm low-power CMOS |
| Configuration Method | SRAM-based (volatile); JTAG, Active Serial, Passive Serial | — |
| Tindminan RoHS | Compliant | Compliant |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 6,272 |
| Embedded Memory (Kbits) | — | 270 |
| Packhaging | — | EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch |
| Core Voltage (VCCINT) | — | 1.2 V |
| I/O Voltage (VCCIO) | — | 1.2 V to 3.3 V (per bank) |
| Temperature ng Junction na Operasyon | — | 0C to +85C (commercial) |
| Maximum Internal Clock Frequency | — | [DATA_NEEDED: max fMAX per logic] |
| Configuration Modes | — | JTAG, Active Serial (EPCS), Passive Serial |
| Lead-Free / Halogen-Free | — | Yes / [DATA_NEEDED: halogen-free status] |