EP4CE6E22C6N vs EP4CE6E22A7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C6N sa pamamagitan ng Intel at EP4CE6E22A7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C6N | EP4CE6E22A7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | — |
| Device | EP4CE6 | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | [DATA_NEEDED: LAB count] | — |
| Embedded Memory (M9K blocks) | [DATA_NEEDED: M9K block count] | — |
| Embedded Memory (Bits) | 270 Kbits | — |
| Embedded 18x18 Multipliers | 15 | — |
| PLLs | 2 | — |
| Global Clock Networks | 10 | 10 |
| Maximum User I/Os | 91 | — |
| I/O Banks | 4 | — |
| Process Technology | 60 nm | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.0 V / 3.3 V | — |
| Configuration Modes | JTAG, AS (Active Serial), PS (Passive Serial) | JTAG, AS, PS, FPP |
| Packhaging | 144-pin EQFP (Plastic Enhanced QFP, 22 x 22 mm, 0.5 mm pitch) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 C to +85 C (industrial, C6 speed grade) | — |
| Tindminan RoHS | Lead-Free / Compliant | Compliant |
| Lead-Free | Yes | — |
| Series | — | Cyclone IV E |
| Logic Elements | — | 6,272 |
| Embedded Memory (bits) | — | 276,480 |
| Embedded Multipliers (18x18) | — | 15 |
| User I/O Pins | — | 91 |
| Number of I/O Banks | — | 4 |
| Number of PLLs | — | 2 |
| Process Node | — | 60 nm low power |
| Core Voltage | — | 1.2 V |
| Operating Temperature Grade | — | Automotive A7 (-40C to +125C junction) |
| Package Type | — | 144-pin EQFP (E22) with exposed pad |