EP4CE6E22C8 vs EP4CE6E22C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE6E22C8 sa pamamagitan ng Intel at EP4CE6E22C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE6E22C8 | EP4CE6E22C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone IV E | — |
| Logic Elements (LEs) | 6,272 | — |
| Logic Array Blocks (LABs) | 392 | 392 LABs |
| Embedded Memory (Kbits) | 270 | — |
| Embedded 18x18 Multipliers | 15 | 15 |
| PLLs | 2 | 2 |
| Maximum User I/Os | 91 | 91 |
| Packhaging | EQFP-144 (E22), 22 x 22 mm, 0.5 mm pitch | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.2 V to 3.3 V (per bank) | — |
| Temperature ng Junction na Operasyon | 0C to +85C (commercial) | — |
| Speed Grade | C8 (-8 corner) | C6 |
| Maximum Internal Clock Frequency | [DATA_NEEDED: max fMAX per logic] | — |
| Configuration Modes | JTAG, Active Serial (EPCS), Passive Serial | — |
| Process Technology | 60 nm low-power CMOS | TSMC 60 nm low-k |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free / Halogen-Free | Yes / [DATA_NEEDED: halogen-free status] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Family | — | Cyclone IV E |
| Device Logic Elements | — | 6,272 LE |
| Total RAM Bits | — | 270 Kbit |
| Core Voltage | — | 1.2 V |
| Temperature na Operasyon | — | 0 °C to +85 °C (Commercial) |
| Package Type | — | 144-pin EQFP (Enhanced QFP, exposed pad) |
| Package Dimensions | — | 22 mm × 22 mm |
| Lead Pitch | — | 0.5 mm |
| Configuration Method | — | SRAM-based (volatile); JTAG, Active Serial, Passive Serial |