EP4CE75F23I8L vs EP4CE55F23I8L Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CE75F23I8L sa pamamagitan ng Intel at EP4CE55F23I8L sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CE75F23I8L | EP4CE55F23I8L |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV E | — |
| Logic Elements | 75,408 | — |
| Embedded Memory (bits) | 2,810,880 | — |
| Number of M9K Memory Blocks | 305 | — |
| Embedded 18x18 Multipliers | 274 | 156 |
| User I/O Pins | 292 | — |
| PLLs | 4 | — |
| Global Clock Networks | 20 | — |
| Maximum User I/O | 292 | — |
| Packhaging | 484-ball FBGA | 484-ball FBGA (23 x 23 mm, 1.0 mm pitch) |
| Temperature na Operasyon | -40C to +85C (Industrial) | — |
| Supply Voltage (Core) | 1.0 V / 1.2 V | — |
| I/O Standards Supported | LVDS, SSTL, HSTL, LVPECL, LVCMOS, LVTTL | LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X |
| Configuration Modes | AS, PS, FPP, JTAG | AS, PS, JTAG |
| Process Node | 60 nm low-leakage | — |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | 3 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Device Family | — | Cyclone IV E |
| Logic Elements (LEs) | — | 55,856 |
| Embedded Memory Bits | — | 2,396,160 bits (~234 Kbit / ~292.5 KByte) |
| Maximum User I/O Pins | — | 324 |
| General-Purpose PLLs | — | 4 |
| Process Technology | — | 60 nm |
| Core Supply Voltage | — | 1.2 V |
| Hanay ng Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Speed Grade | — | 8 |
| Lead-Free / Halogen-Free | — | Yes / Yes |