EP4CGX110DF27I7N vs EP4CGX110DF27I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27I7N sa pamamagitan ng Intel at EP4CGX110DF27I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
EP4CGX110DF27I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX110DF27I7N | EP4CGX110DF27I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | — |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | 4 |
| Core Voltage | 1.2 V | 1.2 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 672-ball FBGA, 1.0 mm pitch | 672-pin FBGA (F27) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Logic Elements | — | 109,424 |
| Process Technology | — | 60 nm low-k |
| Embedded Memory (RAM) | — | 4,608 Kbits |
| Embedded Multipliers (18x18) | — | 280 |
| Maximum User I/O Pins | — | 433 |
| User I/O Banks | — | 8 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | 600 Mbps to 3.125 Gbps |
| Hard IP | — | PCI Express Gen1 (x1/x2) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Speed Grade | — | 8 |