EP4CGX110DF27I7N vs EP4CGX75DF27C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27I7N sa pamamagitan ng Intel at EP4CGX75DF27C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX110DF27I7N - Cyclone IV GX FPGA, 110K LEs, 672-FBGA | Intel
EP4CGX110DF27I7N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX110DF27I7N | EP4CGX75DF27C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | — |
| Device Family | EP4CGX110 | — |
| Logic Elements (LEs) | 109,424 | — |
| Logic Array Blocks (LABs) | 6,422 | — |
| Embedded Memory (bits) | 5,621,760 | — |
| Memory Blocks (M9K) | 610 | — |
| Embedded 18x18 Multipliers | 280 | — |
| User I/Os | 393 | — |
| Transceivers | 8 channels, up to 3.125 Gbps | Integrated (3.125 Gbps) |
| PCIe Hard IP Blocks | 4 (Gen1 x1/x2/x4) | — |
| PLLs | 4 | Yes (periphery and global) |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 672-ball FBGA, 1.0 mm pitch | 672-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Process Node | 60 nm | — |
| Configuration Scheme | AS, PS, JTAG, FPP | — |
| Family | — | Cyclone IV GX |
| Device Logic Elements | — | 73,920 |
| Embedded Memory Bits | — | 4,257,792 |
| Maximum User I/O | — | 310 |
| Process Technology | — | 60 nm CMOS |
| Core Supply Voltage | — | 1.2 V |
| Package Code | — | F27 (672-FBGA) |
| Embedded Multipliers (18x18) | — | 274 |
| PCIe Hard IP | — | Yes (Gen1) |
| Configuration Modes | — | JTAG, Active Serial, Passive Serial |
| Operating Temperature Grade | — | Commercial |
| Speed Grade | — | 6 |