EP4CGX110DF27I8N vs EP4CGX110DF31I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX110DF27I8N sa pamamagitan ng Intel at EP4CGX110DF31I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX110DF27I8N | EP4CGX110DF31I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 109,424 | 109,424 |
| Process Technology | 60 nm low-k | 60 nm |
| Core Voltage | 1.2 V | 1.2 V |
| Packhaging | 672-pin FBGA (F27) | 896-BGA (FineLine BGA) |
| Embedded Memory (RAM) | 4,608 Kbits | — |
| Embedded Multipliers (18x18) | 280 | — |
| PLLs | 4 | — |
| Maximum User I/O Pins | 433 | — |
| User I/O Banks | 8 | — |
| Transceiver Channels | 8 | 8 (max) |
| Transceiver Data Rate | 600 Mbps to 3.125 Gbps | — |
| Hard IP | PCI Express Gen1 (x1/x2) | — |
| Operating Temperature Grade | Industrial (-40C to +100C) | — |
| Speed Grade | 8 | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Tindminan RoHS | Compliant | Compliant |
| Embedded Memory Bits | — | 5,621,760 |
| Maximum User I/Os | — | 475 |
| Embedded 18x18 Multipliers | — | 66 |
| Max Transceiver Data Rate | — | 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Global Clock Networks | — | 20 |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Configuration | — | SRAM-based, supports Active Serial (AS), Passive Serial (PS), JTAG |
| Hard PCIe Gen1 IP | — | Yes (x1/x4) |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |