EP4CGX150DF27C8N vs EP4CGX150DF27I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX150DF27C8N sa pamamagitan ng Intel at EP4CGX150DF27I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX150DF27C8N - Cyclone IV GX FPGA, 149760 Cells, 672-FBGA | Intel
EP4CGX150DF27C8N ✓ Nakahanda
Pagsanggunian na paghahambing
| Parametro | EP4CGX150DF27C8N | EP4CGX150DF27I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Family | Cyclone IV GX | Cyclone IV GX |
| Series | EP4CGX150 | — |
| Logic Elements (LEs) | 149,760 | 149,760 |
| Logic Array Blocks (LABs) | 9,360 | — |
| Embedded Memory Bits | 6,635,520 | 6,635,520 (M9K blocks) |
| Maximum User I/O Pins | 393 | — |
| Transceivers | 8 high-speed serial channels | Up to 8 channels, 3.125 Gbps |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Core Process Technology | 60 nm | — |
| Supply Voltage (Core) | 1.2 V | — |
| Temperature ng Junction na Operasyon | 0 C to +85 C (commercial) | -40 °C to +100 °C (industrial) |
| Speed Grade | C8 (-8, slowest in commercial temp range) | 7 |
| Packhaging | 672-ball FineLine BGA (FBGA), 27 x 27 mm, 1.0 mm pitch | 672-ball FBGA (F27, 1.0 mm pitch) |
| Uri ng Pagpapasok | Surface Mount | — |
| Lead Free / RoHS | Lead free, RoHS compliant | — |
| Embedded Multipliers (18x18) | [DATA_NEEDED: 18x18 multiplier count] | 720 |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| User I/O Count | — | 393 |
| Hard Memory Controller | — | Yes |
| Hard PCI Express | — | Yes (x1 / x2 Gen1) |
| Process Technology | — | 60 nm low-power |
| Core Supply Voltage | — | 1.2 V |
| Configuration Scheme | — | Active serial / passive serial / JTAG |
| Tindminan RoHS | — | Compliant |
| Lead-Free | — | Yes |