EP4CGX50CF23C7 vs EP4CGX50CF23I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50CF23C7 sa pamamagitan ng Intel at EP4CGX50CF23I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50CF23C7 | EP4CGX50CF23I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | — |
| Logic Elements | 49,888 | — |
| Logic Cells | 49,888 | — |
| Embedded Memory Bits | 2,562,048 bits | 2,562,048 |
| Embedded Memory Blocks | M9K blocks, 9 Kbit each | — |
| Maximum User I/O | 290 | 290 |
| Packhaging | 484-FBGA (F23) | 484-ball FBGA (F23), 23 x 23 mm, 1.0 mm pitch |
| Ball Pitch | 1.0 mm | — |
| Core Voltage | 1.2 V | — |
| Process Technology | 60 nm | — |
| Temperature Grade | Commercial (0C to +85C) | — |
| Speed Grade | C7 | — |
| Transceivers | Integrated (Cyclone IV GX) | 8 channels, up to 3.125 Gbps |
| DSP Blocks | 18x18 hardware multipliers | — |
| Tindminan RoHS | Compliant | Compliant (lead-free N suffix) |
| Uri ng Pagpapasok | Surface Mount (FBGA) | Surface Mount (BGA) |
| Device Family | — | Cyclone IV GX |
| Logic Elements (LE) | — | 49,888 |
| Configurable Logic Blocks (CLBs) | — | 3,118 |
| Core Supply Voltage | — | 1.2 V |
| Temperature na Operasyon | — | -40C to +100C (industrial, I7) |
| Configuration Modes | — | AS, PS, JTAG |
| Design Toolchain | — | Quartus II / Quartus Prime |
| Process Node | — | 60 nm (Cyclone IV family) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |