EP4CGX50DF27C6N vs EP4CGX50DF27I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27C6N sa pamamagitan ng Intel at EP4CGX50DF27I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF27C6N | EP4CGX50DF27I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | 3,118 | — |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | 2,502 Kbits |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | — |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | 1.2 V |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | 60 nm low-power |
| Packhaging | 672-ball FineLine BGA (FBGA) | 672-ball FBGA (F27) |
| Temperature na Operasyon | 0C to +85C (commercial) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 49,888 |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |