EP4CGX50DF27C6N vs EP4CGX50DF27I7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27C6N sa pamamagitan ng Intel at EP4CGX50DF27I7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF27C6N | EP4CGX50DF27I7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements (LE) | 49,888 | — |
| Logic Array Blocks (LAB) | 3,118 | — |
| Embedded Memory | 2,562,048 bits (~313 Kbyte) | 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit |
| Embedded Memory Blocks | M9K | — |
| Embedded 18x18 Multipliers | 140 | 56 |
| User I/O Pins | 310 | — |
| Transceivers | Up to 8 channels, 3.125 Gbps | — |
| PLLs | 4 | — |
| Global Clocks | 20 | — |
| Core Voltage | 1.2 V | — |
| Speed Grade | C6 (commercial) | — |
| Process Technology | 60 nm low-power | 60 nm |
| Packhaging | 672-ball FineLine BGA (FBGA) | 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch) |
| Temperature na Operasyon | 0C to +85C (commercial) | -40 C to +100 C (industrial I7 grade) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements | — | 49,888 LE |
| Number of LABs/CLBs | — | 3,118 |
| User I/Os | — | 310 |
| Number of Transceivers | — | 8 (up to 3.125 Gbps) |
| PCIe Hard IP | — | 1 Gen1 controller (x1/x2/x4) |
| Core Supply Voltage | — | 1.2 V |
| Configuration Method | — | SRAM-based, JTAG/AS/PS |