EP4CGX50DF27I6N vs EP4CGX50DF27C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27I6N sa pamamagitan ng Intel at EP4CGX50DF27C7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF27I6N | EP4CGX50DF27C7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 | — |
| Process Technology | 60 nm low-power | — |
| Core Voltage | 1.2 V | — |
| Embedded Memory | 2,502 Kbits | — |
| Embedded Multipliers (18x18) | 113 | — |
| Maximum User I/O | 310 | — |
| Transceiver Channels | 8 | — |
| Transceiver Data Rate | up to 3.125 Gbps | — |
| General-purpose PLLs | 4 | — |
| Packhaging | 672-ball FBGA (F27) | 672-pin FBGA (FineLine BGA) |
| Operating Temperature (Industrial grade) | -40C to +100C junction | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 49,888 |
| Logic Array Blocks (LAB) | — | [DATA_NEEDED: LAB count for EP4CGX50] |
| Total Embedded Memory Bits | — | 2,562,048 |
| User I/O Pins (max) | — | 310 |
| Transceivers | — | Yes (3.125 Gbps GX channels, package-dependent) |
| Core Supply Voltage | — | 1.2 V |
| Process Node | — | 60 nm |
| Operating Temperature (Commercial 'C') | — | 0C to +85C |
| PLL Count | — | 6 |
| Hard Memory Controller | — | DDR/DDR2/DDR3/QDRII/RLDRAM PHY |
| Lead-Free | — | Yes |