EP4CGX50DF27I7 vs EP4CGX50DF27C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27I7 sa pamamagitan ng Intel at EP4CGX50DF27C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX50DF27I7 | EP4CGX50DF27C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 LE | — |
| Embedded Memory | 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit | 2,562,048 bits (~313 Kbyte) |
| Number of LABs/CLBs | 3,118 | — |
| Embedded 18x18 Multipliers | 56 | 140 |
| User I/Os | 310 | — |
| Number of Transceivers | 8 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 1 Gen1 controller (x1/x2/x4) | — |
| Process Technology | 60 nm | 60 nm low-power |
| Core Supply Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 C to +100 C (industrial I7 grade) | 0C to +85C (commercial) |
| Packhaging | 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch) | 672-ball FineLine BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG/AS/PS | — |
| Tindminan RoHS | Compliant | Compliant |
| Logic Elements (LE) | — | 49,888 |
| Logic Array Blocks (LAB) | — | 3,118 |
| Embedded Memory Blocks | — | M9K |
| User I/O Pins | — | 310 |
| Transceivers | — | Up to 8 channels, 3.125 Gbps |
| PLLs | — | 4 |
| Global Clocks | — | 20 |
| Core Voltage | — | 1.2 V |
| Speed Grade | — | C6 (commercial) |