EP4CGX50DF27I7 vs EP4CGX50DF27I6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX50DF27I7 sa pamamagitan ng Intel at EP4CGX50DF27I6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4CGX50DF27I6N - Cyclone IV GX FPGA, 49.9K LEs, 672-FBGA | Intel (Altera)
EP4CGX50DF27I6N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4CGX50DF27I7 | EP4CGX50DF27I6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 49,888 LE | 49,888 |
| Embedded Memory | 2,562,048 bits (2.44 Mbit) / 250 M9K blocks of 9 Kbit | 2,502 Kbits |
| Number of LABs/CLBs | 3,118 | — |
| Embedded 18x18 Multipliers | 56 | — |
| User I/Os | 310 | — |
| Number of Transceivers | 8 (up to 3.125 Gbps) | — |
| PCIe Hard IP | 1 Gen1 controller (x1/x2/x4) | — |
| Process Technology | 60 nm | 60 nm low-power |
| Core Supply Voltage | 1.2 V | — |
| Temperature na Operasyon | -40 C to +100 C (industrial I7 grade) | — |
| Packhaging | 672-ball FBGA (F27, 27x27 mm, 1.0 mm pitch) | 672-ball FBGA (F27) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Configuration Method | SRAM-based, JTAG/AS/PS | — |
| Tindminan RoHS | Compliant | Compliant |
| Core Voltage | — | 1.2 V |
| Embedded Multipliers (18x18) | — | 113 |
| Maximum User I/O | — | 310 |
| Transceiver Channels | — | 8 |
| Transceiver Data Rate | — | up to 3.125 Gbps |
| General-purpose PLLs | — | 4 |
| Operating Temperature (Industrial grade) | — | -40C to +100C junction |
| Configuration Modes | — | AS, PS, FPP, JTAG |