EP4CGX75CF23C7N vs EP4CGX75DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23C7N sa pamamagitan ng Intel at EP4CGX75DF27C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75CF23C7N | EP4CGX75DF27C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Embedded Memory (bits) | 4,257,792 | — |
| Maximum User I/O Pins | 290 | — |
| Number of Logic Array Blocks (LABs) | 4,500 | — |
| Total Transceiver Channels | 8 (up to 3.125 Gbps) | — |
| Number of PLLs | 4 | — |
| Hard Memory Controllers | 2 | — |
| Core Supply Voltage | 1.16 V to 1.24 V (nominal 1.2 V) | — |
| Temperature na Operasyon | 0 °C to 85 °C (commercial) | [DATA_NEEDED: operating temperature range] |
| Packhaging | 484-ball BGA (F23, 23 x 23 mm) | 672-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Process Technology | 60 nm low-power CMOS | — |
| Configuration Modes | AS, PS, FPP, JTAG | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Volte ng Pagbibigay | — | 1.2 V |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |