EP4CGX75CF23I7 vs EP4CGX75DF27C7 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4CGX75CF23I7 sa pamamagitan ng Intel at EP4CGX75DF27C7 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4CGX75CF23I7 | EP4CGX75DF27C7 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Cyclone IV GX | Cyclone IV GX |
| Logic Elements | 73,920 | — |
| Total Memory Bits | 4,257,792 | — |
| Number of LABs/CLBs | 4,620 | — |
| Number of Logic Elements/Cells | 73,920 | — |
| Total RAM Bits | 4,257,792 | — |
| Number of I/O | 290 | — |
| Number of Multipliers (18x18) | 290 | — |
| Voltage Supply | 1.0 V / 1.2 V / 2.5 V / 3.3 V | — |
| Core Voltage | 1.2 V | — |
| Temperature na Operasyon | -40C to +100C (Industrial I7 grade) | [DATA_NEEDED: operating temperature range] |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Packhaging / Kaso | 484-FBGA (FBGA-484, 23x23 mm, 1.0 mm pitch) | — |
| Process Technology | 60 nm | — |
| Transceiver Speed | 3.125 Gbps | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Device Type | — | Field Programmable Gate Array (FPGA) |
| Logic Cells | — | 73,920 |
| Configurable Logic Blocks | — | 4,620 |
| User I/O | — | 310 |
| Configuration-related Bits | — | 4,257,792 |
| Volte ng Pagbibigay | — | 1.2 V |
| Packhaging | — | 672-ball FBGA |
| Package Body | — | 27 mm x 27 mm |
| Ball Pitch | — | 1 mm |
| Terminal Form | — | Ball |
| Package Code | — | BGA |
| REACH Status | — | [DATA_NEEDED: REACH status] |