EP4S40G2F40I2NAB vs EP4CGX75DF27I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4S40G2F40I2NAB sa pamamagitan ng Intel at EP4CGX75DF27I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP4S40G2F40I2NAB - Stratix IV GT FPGA, 228K LE, 1517-FCBGA | Intel
EP4S40G2F40I2NAB ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP4S40G2F40I2NAB | EP4CGX75DF27I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Stratix IV GT | Cyclone IV GX |
| Logic Elements (LE) | 228,000 | 73,920 |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | — |
| Total Embedded Memory Bits | 17,544,192 | — |
| Embedded Memory Type | M9K + M144K blocks | — |
| User I/O Pins | 654 | — |
| Multi-Gigigabit Transceivers | 48 (Stratix IV GT, configuration-dependent) | — |
| Transceiver Data Rate | 600 Mbps to 11.3 Gbps | 3.125 Gbps |
| PLLs | 8 | — |
| Hard IP for PCIe | Gen1 / Gen2 endpoints | — |
| Core Voltage | 0.95 V | — |
| Process Technology | 40 nm | 60 nm |
| Packhaging | 1517-ball FCBGA (F40) | FBGA-672 (27 mm) |
| Temperature na Operasyon | -40C to +100C (industrial, I2) | -40C to +100C (Industrial, I7) |
| Level ng MSL | 4 (72 hours floor life) | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | — |
| Device Model | — | EP4CGX75 |
| Embedded Memory | — | 4,257,792 bits (M9K blocks) |
| User I/O Count | — | 310 |
| Supply Voltage - Core | — | 1.2 V |
| Number of Transceivers | — | 8 channels |
| Hard PCIe Block | — | Gen1 x1/x2/x4 (PIPE) |
| Number of PLLs | — | 8 |
| Number of I/O Banks | — | 8 |
| Configuration Modes | — | JTAG, AS, AP, PS |
| Tindminan RoHS | — | Compliant |