EP4SGX360FF35I3 vs EP4SGX360FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP4SGX360FF35I3 sa pamamagitan ng Intel at EP4SGX360FF35C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP4SGX360FF35I3 | EP4SGX360FF35C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Series | Stratix IV GX | Stratix IV GX |
| Family | Stratix IV GX | Stratix IV GX |
| Logic Elements (LE) | 353,600 | — |
| LABs/CLBs | 14,144 | — |
| Total RAM Bits | 23,105,536 | — |
| Embedded Memory | [DATA_NEEDED: total Kbits] | — |
| User I/O Count | 564 | — |
| Number of I/O Banks | [DATA_NEEDED: I/O bank count] | — |
| Number of Transceivers | [DATA_NEEDED: transceiver count] | — |
| Transceiver Data Rate (max) | [DATA_NEEDED: Gbps] | — |
| Number of PLLs | [DATA_NEEDED: PLL count] | — |
| Core Voltage | 0.9 V | 0.9 V |
| Process Technology | 40 nm | 40 nm |
| Temperature na Operasyon | -40C to +100C | — |
| Packhaging | 1152-BBGA, FCBGA (Flip-Chip) | 1152-ball FC-BGA (FF35) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Speed Grade | I3 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Level ng MSL | [DATA_NEEDED: MSL] | — |
| Logic Elements | — | 353,600 |
| Adaptive Logic Modules (ALMs) | — | 141,440 (Mouser reports 14,144 LABs) |
| Memory Bits | — | 23,105,536 bits (~22 Mbit) |
| Maximum User I/Os | — | 564 |
| Number of LABs/CLBs | — | 14144 |
| Transceivers | — | [DATA_NEEDED: transceiver count and data rate] |
| Operating Temperature Grade | — | Commercial (C4) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |
| Part Status | — | Obsolete (per Micropcba / distributor listings) |