EPF10K100ABI356-3 vs EPF10K100EBC356-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100ABI356-3 sa pamamagitan ng Intel at EPF10K100EBC356-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera
EPF10K100ABI356-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K100ABI356-3 | EPF10K100EBC356-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | NRND |
| Family | FLEX 10KA | — |
| Typical Gates | 100,000 | 100,000 |
| Logic Elements (LEs) | 4992 | — |
| Logic Array Blocks (LABs) | 624 | 624 |
| Embedded Memory (RAM bits) | 24576 | — |
| Maximum User I/Os | 274 | — |
| Packhaging | 356-LBGA | — |
| Logic Family | CMOS | CMOS |
| Process Technology | 0.3 um | — |
| Volte ng Pagbibigay | 3.3 V | — |
| Temperature na Operasyon | 0 C to 70 C | 0 C to +70 C (Commercial) |
| Propagation Delay | 0.6 ns | 0.6 ns |
| Maximum Frequency | 125 MHz | — |
| Speed Grade | -3 (slowest of three grades) | -1X |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status not stated in source data] | [DATA_NEEDED: RoHS status] |
| Series | — | FLEX 10KE |
| Logic Elements | — | 4,992 |
| Embedded Array Blocks (EABs) | — | 12 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 274 |
| Core Process Technology | — | 0.22 um CMOS, 5 metal layers |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V (multi-volt tolerant to 5 V) |
| Package Type | — | 356-LBGA (BGA-356) |
| Package Dimensions | — | 35 x 35 mm, 1.27 mm ball pitch |
| Configuration Method | — | Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |