EPF10K100ABI356-3 vs EPF10K100EBC356-1X Pengandingan

Pengandingan Sisi Kiri Sisi Kanan Terperinci EPF10K100ABI356-3 disebabkan oleh Intel dan EPF10K100EBC356-1X disebabkan oleh Intel. Bandingkan spesifikasi utama, parameter elektrik, pakej, status kehidupan, harga, dan keupayaan untuk menentukan komponen terbaik untuk keperluan disenjaya anda.

Intel
EPF10K100ABI356-3 EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera

EPF10K100ABI356-3 - FLEX 10KA FPGA 100K Gates 356-BGA | Altera

EPF10K100ABI356-3 ⚠ Bahagian terakhir untuk beli

Pengandingan Spesifikasi

Parametr EPF10K100ABI356-3 EPF10K100EBC356-1X
Merek Intel Intel
Kategori FPGA & CPLD FPGA & CPLD
Status Lingkungan Hidup Masa Terakhir Dibeli NRND
Family FLEX 10KA —
Typical Gates 100,000 100,000
Logic Elements (LEs) 4992 —
Logic Array Blocks (LABs) 624 624
Embedded Memory (RAM bits) 24576 —
Maximum User I/Os 274 —
Kemasan 356-LBGA —
Logic Family CMOS CMOS
Process Technology 0.3 um —
Tegangan Pemberi Arus 3.3 V —
Suhu Operasi 0 C to 70 C 0 C to +70 C (Commercial)
Propagation Delay 0.6 ns 0.6 ns
Maximum Frequency 125 MHz —
Speed Grade -3 (slowest of three grades) -1X
Jenis Pemasangan Surface Mount Surface Mount (BGA)
Status RoHS [DATA_NEEDED: RoHS status not stated in source data] [DATA_NEEDED: RoHS status]
Series — FLEX 10KE
Logic Elements — 4,992
Embedded Array Blocks (EABs) — 12
Total RAM Bits — 49,152
User I/O Count — 274
Core Process Technology — 0.22 um CMOS, 5 metal layers
Core Supply Voltage — 2.5 V (2.375 V to 2.625 V)
I/O Supply Voltage — 3.3 V (multi-volt tolerant to 5 V)
Package Type — 356-LBGA (BGA-356)
Package Dimensions — 35 x 35 mm, 1.27 mm ball pitch
Configuration Method — Serial EPROM / Parallel EPROM / JTAG (IEEE 1149.1)
Aras MSL — [DATA_NEEDED: MSL rating]

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