EPF10K100EFC256-2X vs EPF10K100EFC256-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFC256-2X sa pamamagitan ng Altera at EPF10K100EFC256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPF10K100EFC256-2X - FLEX 10KE FPGA, 49,152 Gates, 256-BGA | Altera
EPF10K100EFC256-2X ObsoleteIntel
EPF10K100EFC256-2 - FLEX 10KE FPGA, 100K Gates, 256-BGA | Intel / Altera
EPF10K100EFC256-2 NrndPagsanggunian na paghahambing
| Parametro | EPF10K100EFC256-2X | EPF10K100EFC256-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Series | FLEX-10KE | FLEX 10KE |
| Family | FLEX 10KE | — |
| Logic Elements / Cells | 49,152 | 4,992 (49,152 user logic elements) |
| Number of LABs/CLBs | 624 | — |
| Number of Logic Elements/Cells | 4,992 | — |
| Total RAM Bits | 49,152 | [DATA_NEEDED: total EAB RAM bits] |
| Number of I/O | 191 | — |
| Number of Gates | 100,000 | 100,000 equivalent |
| Voltage - Supply | 2.375V to 2.625V (core), 3.0V to 3.6V (I/O) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0°C to 70°C | 0 °C to +70 °C (Commercial) |
| Packhaging / Kaso | 256-FBGA (FineLine BGA, 17x17 mm) | — |
| Supplier Device Package | 256-BGA | — |
| Speed Grade | -2 | — |
| Logic Family | CMOS (SRAM-based) | CMOS (SRAM-based) |
| Propagation Delay | 0.6 ns (per EAB) | — |
| Configuration Interface | JTAG / Passive Serial / Active Serial | — |
| Lead-Free / RoHS Status | Depends on date code - verify with distributor | — |
| Level ng MSL | [DATA_NEEDED: MSL moisture sensitivity level] | — |
| Manufacturer | — | Intel (formerly Altera) |
| Number of LABs | — | 624 |
| User I/Os | — | 191 |
| Core Supply Voltage (VCCINT) | — | 2.375 V to 2.625 V |
| Propagation Delay (per LUT) | — | ~0.6 ns (speed grade -2) |
| Packhaging | — | 256-FBGA (FineLine BGA, 17 x 17 mm) |
| Configuration Method | — | PS, JTAG, in-system programmable |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance] |
| Embedded Array Blocks | — | Yes (EAB for RAM/ROM/DSP) |