EPF10K100EFC484-1N vs EPF10K100EFC484-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFC484-1N sa pamamagitan ng Intel at EPF10K100EFC484-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100EFC484-1N - 100K FLEX 10KE FPGA, 338 I/O, 484-BGA | Intel
EPF10K100EFC484-1N ObsoletePagsanggunian na paghahambing
| Parametro | EPF10K100EFC484-1N | EPF10K100EFC484-1X |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Manufacturer | Intel (formerly Altera) | — |
| Series | FLEX 10KE | FLEX-10KE® |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Logic Elements / Cells | 4,992 | 4992 |
| Equivalent Gates | 100,000 | — |
| Embedded Memory Bits | 49,152 bits | — |
| Number of LABs | 624 | — |
| Number of Logic Elements | 4,992 | — |
| User I/Os | 338 | — |
| Bilang ng Pins | 356 (BGA-356 per one source) / 484 (BGA-484 per other sources) | — |
| Packhaging | 484-BBGA (FineLine BGA) | 484-FBGA (FineLine BGA, 23 × 23 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Logic Family | CMOS | — |
| Process Technology | 0.22 µm CMOS SRAM | 0.22 µm CMOS |
| Core Supply Voltage | 2.5 V | — |
| I/O Supply Voltage | 3.3 V (5 V-tolerant inputs via VCCIO) | — |
| Propagation Delay (worst case) | 0.6 ns | — |
| Temperature na Operasyon | 0 °C to 70 °C (commercial) | 0 °C to +70 °C (commercial) |
| Configuration | SRAM-based, in-system reprogrammable | — |
| JTAG / IEEE 1149.1 | Yes | — |
| Tindminan RoHS | compliant (lead-free FBGA) | [DATA_NEEDED: RoHS status] |
| Katayuan ng Lifecycle | Obsolete (NRND per Intel/Altera PCN history) | — |
| Family | — | FLEX 10KE |
| System Gates | — | 100,000 |
| Logic Array Blocks (LABs) | — | 624 |
| Total RAM Bits | — | 49,152 |
| User I/O Count | — | 338 |
| Number of I/O Pins | — | 338 (package provides up to 488 bonded I/O pads) |
| Supply Voltage (Core) | — | 2.5 V (2.375 V – 2.625 V) |
| Supply Voltage (I/O) | — | 3.3 V |
| Maximum Internal Frequency | — | 333.33 MHz |
| Propagation Delay | — | 0.6 ns (per logic element, typical) |
| Programming Interface | — | JTAG / serial (ByteBlaster-compatible) |