EPF10K100EFI256-2 vs EPF10K100EFC256-2 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EFI256-2 sa pamamagitan ng Intel at EPF10K100EFC256-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EPF10K100EFI256-2 EPF10K100EFC256-2
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family FLEX 10KE —
Typical Gates 100,000 —
Logic Elements / Cells 4,992 4,992 (49,152 user logic elements)
Total RAM Bits 49,152 [DATA_NEEDED: total EAB RAM bits]
Logic Array Blocks (LABs) 624 —
Embedded Array Blocks (EABs) 12 —
User I/O Pins 191 —
Packhaging 256-Ball FineLine BGA (FBGA-256) 256-FBGA (FineLine BGA, 17 x 17 mm)
Package Body Size 17 x 17 mm —
Ball Pitch 1.0 mm —
Supply Voltage - Core 2.5 V —
Supply Voltage - I/O 3.3 V —
Maximum Toggle Frequency 250 MHz —
Propagation Delay 0.5 ns (typical) —
Process Technology 0.22 µm CMOS, 4-layer metal 0.22 µm CMOS SRAM
Temperature na Operasyon 0C to +70C (commercial) 0 °C to +70 °C (Commercial)
Configuration Mode Passive Serial / JTAG —
Tindminan RoHS unknown [DATA_NEEDED: RoHS compliance]
Series — FLEX 10KE
Manufacturer — Intel (formerly Altera)
Number of LABs — 624
User I/Os — 191
Number of Gates — 100,000 equivalent
Core Supply Voltage (VCCINT) — 2.375 V to 2.625 V
Logic Family — CMOS (SRAM-based)
Propagation Delay (per LUT) — ~0.6 ns (speed grade -2)
Uri ng Pagpapasok — Surface Mount (BGA)
Configuration Method — PS, JTAG, in-system programmable
Embedded Array Blocks — Yes (EAB for RAM/ROM/DSP)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita