EPF10K100EQC240-1 vs EPF10K100BQC240-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K100EQC240-1 sa pamamagitan ng Altera at EPF10K100BQC240-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K100BQC240-1 - 100K FLEX-10K FPGA, 240-PQFP | Intel / Altera
EPF10K100BQC240-1 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K100EQC240-1 | EPF10K100BQC240-1 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | FLEX 10KE | FLEX-10K (EPF10K100B) |
| Series | FLEX-10KE | FLEX-10K |
| Logic Elements / Cells | 4992 | — |
| Number of LABs / CLBs | 624 | — |
| Total RAM Bits | 49152 | 24,576 (12 × 2,048 bits per EAB) |
| Typical Gate Count | 100000 | — |
| Number of User I/Os | 189 | — |
| Supply Voltage (Core) | 2.375 V to 2.625 V | — |
| I/O Voltage | 3.3 V (MultiVolt: 1.8 V / 2.5 V / 3.3 V) | — |
| Process Technology | CMOS (0.42 µm) | 0.42 µm SRAM CMOS |
| Propagation Delay | 0.4 ns to 0.6 ns | — |
| Temperature na Operasyon | 0 °C to 70 °C (Commercial) | 0 °C to +70 °C (commercial) |
| Packhaging | 240-BFQFP (PQFP240, 32 x 32 mm) | 240-pin BFQFP / PQFP (BQC suffix) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Style ng Pagpapasok | SMD / SMT | — |
| Tindminan RoHS | [DATA_NEEDED: rohs] | [DATA_NEEDED: RoHS compliance] |
| Configuration Method | SRAM (serial / JTAG) | ByteBlasterMV / BitBlaster / JTAG |
| Embedded Memory | EABs (12 blocks × 2048 bits) | — |
| JTAG Support | IEEE 1149.1 Boundary-Scan | — |
| Status | Obsolete (EOL) | — |
| Logic Elements (LEs) | — | 6,144 |
| Typical Gates | — | 100,000 |
| Embedded Array Blocks (EABs) | — | 12 |
| Maximum User I/O | — | 189 |
| Supply Voltage (VCCINT / VCCIO) | — | 4.75 V to 5.25 V |
| Speed Grade | — | -1 |
| Combinatorial tPD (typical) | — | 11 ns |
| Package Dimensions | — | 32 mm × 32 mm |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |