EPF10K130EFC484-2N vs EPF10K130EFC484-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-2N sa pamamagitan ng Altera at EPF10K130EFC484-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC484-2N | EPF10K130EFC484-3 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Product Type | Field Programmable Gate Array (FPGA) | — |
| Series | FLEX-10KE | — |
| Gate Count | 130,000 gates | — |
| Logic Cells | 6,656 cells | — |
| Logic Family | CMOS | CMOS (SRAM-based) |
| Process Technology | 0.22 µm | — |
| Listed Maximum Frequency | 333.33 MHz | — |
| Propagation Delay | 0.6000 ns | 0.6 ns (per LE) |
| User I/Os | 369 I/Os | — |
| Alternative I/O Count Listing | 274 I/Os | — |
| Embedded Memory | 65,536 bits | — |
| Logic Array Blocks | 832 LABs | — |
| Volte ng Pagbibigay | 2.5 V nominal | — |
| Verified Supply-Voltage Range | 2.375 V to 2.625 V | — |
| Alternate Supply Listing | 3.3 V | — |
| Temperature na Operasyon | 0 °C to 70 °C | 0 C to +70 C (commercial) |
| Packhaging | 484-ball FBGA, 23 mm × 23 mm | 484-pin FBGA (FineLine BGA) |
| Package Pin Count | 356 pins | — |
| Ball Pitch | 1 mm | — |
| RoHS Compliance | unknown | — |
| REACH Compliance | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Lead-Free Status | unknown | — |
| Halogen-Free Status | unknown | — |
| Family | — | FLEX 10KE |
| Logic Elements (LEs) | — | 6,656 |
| Typical Gate Count | — | 130,000 system gates |
| Logic Array Blocks (LABs) | — | 832 |
| Embedded Memory (EABs) | — | 16 x 4,096 bits (65,536 bits total) |
| Maximum User I/O | — | 369 |
| Supply Voltage (Core) | — | 3.3 V |
| I/O Voltage Support | — | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) |
| Speed Grade | — | -3 |
| Uri ng Pagpapasok | — | Surface Mount (BGA) |
| Configuration Method | — | SRAM-based, serial or parallel, requires external configuration device |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |