EPF10K130EFC484-3 vs EPF10K100EFC484-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC484-3 sa pamamagitan ng Intel at EPF10K100EFC484-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC484-3 | EPF10K100EFC484-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements (LEs) | 6,656 | — |
| Typical Gate Count | 130,000 system gates | — |
| Logic Array Blocks (LABs) | 832 | 624 |
| Embedded Memory (EABs) | 16 x 4,096 bits (65,536 bits total) | — |
| Maximum User I/O | 369 | — |
| Supply Voltage (Core) | 3.3 V | — |
| I/O Voltage Support | 5.0 V / 3.3 V / 2.5 V (multi-volt I/O) | — |
| Propagation Delay | 0.6 ns (per LE) | — |
| Speed Grade | -3 | -3 (fastest commercial) |
| Temperature na Operasyon | 0 C to +70 C (commercial) | 0C to +70C (Commercial) |
| Packhaging | 484-pin FBGA (FineLine BGA) | 484-ball FineLine BGA |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Configuration Method | SRAM-based, serial or parallel, requires external configuration device | SRAM (volatile, requires configuration device) |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS (SRAM-based) | — |
| Typical Gates | — | 100,000 |
| Maximum System Gates | — | 158,000 |
| Logic Elements | — | 4,992 |
| Embedded Memory (EAB RAM) | — | 49,152 bits |
| User I/O Pins | — | 338 |
| Core Voltage | — | 2.5 V |
| I/O Standards Supported | — | 2.5V / 3.3V / 5.0V (PCI-compliant) |
| JTAG Support | — | IEEE Std. 1149.1-1990 BST |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |