EPF10K130EFC672-1X vs EPF10K130EFC672-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K130EFC672-1X sa pamamagitan ng Intel at EPF10K130EFC672-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K130EFC672-1X | EPF10K130EFC672-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | FLEX 10KE | FLEX 10KE |
| Series | FLEX 10KE® | — |
| Typical Gates | 130,000 | — |
| Logic Elements (LEs) | 6,656 | — |
| Total RAM Bits | 65,536 | — |
| Logic Array Blocks (LABs) | 832 | 832 |
| User I/Os | 413 | — |
| Number of I/O Banks | 8 | — |
| Core Voltage | 2.5 V (2.375 V to 2.625 V) | — |
| Internal Operating Frequency | up to 333.33 MHz | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS |
| Packhaging | 672-ball FBGA, 27x27 mm, 1.0 mm pitch | 672-ball FineLine BGA |
| Speed Grade | -1X | -2 |
| Operating Temperature (Commercial) | 0 °C to +70 °C | — |
| Configuration Mode | Passive Serial, JTAG, ByteBlaster | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Moisture Sensitivity Level | MSL 3 (per JEDEC J-STD-020) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements / Cells | — | 6,656 |
| Total Gates | — | ~130,000 |
| Embedded Memory (RAM bits) | — | 65,536 |
| Maximum User I/Os | — | 413 |
| Number of I/O Pins | — | 672 (package pins) |
| Core Supply Voltage | — | 2.5 V |
| Propagation Delay (typ.) | — | 0.6 ns |
| Internal Operating Frequency (max) | — | 333.33 MHz |
| Temperature na Operasyon | — | 0 °C to +70 °C (Commercial) |
| Programming Method | — | SRAM-based, JTAG (IEEE 1149.1) |