EPF10K200EFC672-3 vs EPF10K250EFC672-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EFC672-3 sa pamamagitan ng Intel at EPF10K250EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EFC672-3 - FLEX 10KE FPGA 9984 Cells 470 I/O BGA-672 | Intel
EPF10K200EFC672-3 Obsolete
Pagsanggunian na paghahambing
| Parametro | EPF10K200EFC672-3 | EPF10K250EFC672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | FLEX 10KE | — |
| Number of Logic Elements / Cells | 9,984 | — |
| Number of LABs / CLBs | 1248 | — |
| Total RAM Bits | 98,304 bits (12 EABs of 8 Kbits) | — |
| Number of I/O | 470 | — |
| Number of Gates (typical) | 200,000 | — |
| Supply Voltage - Operating | 2.3 V to 2.7 V (2.5 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.25 um CMOS, 5-layer metal |
| Maximum Operating Frequency | 166.67 MHz | — |
| Propagation Delay | 0.4 ns | — |
| Packhaging / Kaso | 672-BBGA (27 x 27 mm, 1.0 mm pitch, FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 °C to +70 °C (commercial) | — |
| Configuration Memory | SRAM-based (volatile, requires external configuration device) | — |
| Number of PLLs | 4 | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Lead-Free | [DATA_NEEDED: lead-free status] | [DATA_NEEDED: lead-free status] |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Family | — | FLEX 10KE |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Speed Grade | — | -3 (fastest) |
| Temperature Grade | — | Commercial (0C to +70C) |
| Packhaging | — | 672-ball FineLine BGA (FC) |
| Ball Pitch | — | 1.0 mm |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |