EPF10K200EGC599-1 vs EPF10K200EFC672-1 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200EGC599-1 sa pamamagitan ng Intel at EPF10K200EFC672-1 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera
EPF10K200EGC599-1 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EPF10K200EGC599-1 | EPF10K200EFC672-1 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | FLEX 10KE | FLEX-10KE |
| Logic Elements (LEs) | 9,984 | — |
| Typical Gates | 200,000 | 200,000 |
| Embedded Array Blocks (EABs) | 470 | — |
| Total RAM Bits | 98,304 | — |
| Core Supply Voltage | 2.375 V to 2.625 V | — |
| I/O Voltage Tolerance | 5.0 V tolerant | — |
| Bilang ng Pin | 599 | — |
| Package Type | 599-BCPGA (Ceramic Pin Grid Array) | — |
| Package Dimensions | 62.48 x 62.48 mm | — |
| Uri ng Pagpapasok | Through-Hole (Socket or Solder) | Surface Mount |
| Temperature na Operasyon | 0C to +70C (Commercial) | 0 C to 70 C (Commercial) |
| Programming Interface | JTAG (IEEE 1149.1) | — |
| PLLs | 4 | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status of ceramic CPGA variant] | Compliant |
| Logic Elements | — | 9,984 |
| User I/Os | — | 470 |
| Embedded Memory (bits) | — | 98,304 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Packhaging | — | 672-FBGA (FineLine BGA), 27x27 mm, 1.27 mm pitch |
| Process Technology | — | CMOS, SRAM-based |
| Propagation Delay | — | 0.4 ns |
| Speed Grade | — | -1 |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, True-LVDS |
| Core Voltage | — | 2.5 V (typical, FLEX-10KE) |
| Supply Voltage - Max | — | 3.3 V (I/O) |
| Level ng MSL | — | 3 (168 hours) |