EPF10K200SBC356-1X vs EPF10K200SBC356-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K200SBC356-1X sa pamamagitan ng Intel at EPF10K200SBC356-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K200SBC356-1X - 200K Flex 10KE FPGA, 274 I/O, 356-BGA | Intel
EPF10K200SBC356-1X ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K200SBC356-1X | EPF10K200SBC356-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | FLEX 10KE | FLEX 10KS (Embedded Programmable Logic) |
| Series | FLEX-10KS | FLEX 10KS |
| Typical System Gates | 200,000 | — |
| Maximum System Gates | 513,000 | — |
| Logic Elements (LEs) | 9,984 | — |
| Logic Array Blocks (LABs) | 1,248 | 1248 |
| Embedded Array Blocks (EABs) | 12 | — |
| Total RAM Bits | 39,616 | — |
| User I/Os | 274 | 274 |
| Process Technology | 0.22 µm CMOS | 0.22 um CMOS |
| Core Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) | — |
| I/O Voltage (VCCIO) | 1.8 V / 2.5 V / 3.3 V / 5.0 V (multi-volt I/O) | — |
| Packhaging | 356-LBGA (BGA-356), 35 x 35 mm, 1.27 mm pitch | 356-LBGA (FineLine BGA, 35 x 35 mm, 1.27 mm pitch) |
| Operating Temperature Grade | Commercial | — |
| Speed Grade | -1 (fastest commercial bin) | -2 |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| JTAG Support | IEEE Std. 1149.1 boundary scan + ISP | — |
| Lead Free / RoHS | Yes (per -1X suffix) | — |
| Configuration Mode | SRAM-based, ISP via JTAG | — |
| Logic Elements / Cells | — | 9984 |
| Embedded Memory Bits (EAB) | — | 98304 |
| System Gates | — | 200,000 |
| Number of I/O Banks | — | 8 |
| Supply Voltage (Core) | — | 2.5 V (2.375 V - 2.625 V) |
| I/O Voltage (PCI-compatible) | — | 3.3 V / 5.0 V tolerant |
| Propagation Delay | — | 0.4 ns (per datasheet) |
| Temperature na Operasyon | — | 0C to +70C (Commercial) |
| Configuration | — | SRAM-based (volatile, requires configuration device) |
| Boundary Scan | — | Yes (JTAG IEEE 1149.1) |
| PLL | — | Yes (on-chip) |
| Tindminan RoHS | — | Non-compliant (legacy part) |