EPF10K250EBI600-3 vs EPF10K200SBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBI600-3 sa pamamagitan ng Intel at EPF10K200SBC600-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K250EBI600-3 | EPF10K200SBC600-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | FLEX 10KE | — |
| Logic Elements | 12,160 | — |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | 4 |
| On-chip RAM | Up to 40 Kbits | — |
| Packhaging | 600-ball BGA (HBGA) | — |
| Ball Pitch | 1.93 mm | — |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | — |
| Temperature na Operasyon | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | 0 C to 70 C |
| Speed Grade | -3 (fastest) | — |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.22 micrometer |
| Configuration Method | SRAM, requires external configuration device (EPC series) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Not specified (SnPb / tin-lead finish per legacy distributor listing) | Non-compliant |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Manufacturer | — | Altera (now Intel) |
| Series | — | FLEX-10KS |
| Logic Elements / Cells | — | 9,984 |
| Logic Array Blocks (LABs) | — | 1,248 |
| Typical Gates | — | 200,000 |
| User I/Os | — | 470 |
| Propagation Delay | — | 0.4 ns |
| Voltage - Supply (VCCINT) | — | 2.375 V to 2.625 V |
| Packhaging / Kaso | — | 600-BGA (45 x 45 mm, 1.27 mm pitch) |
| Supplier Device Package | — | 600-BGA |
| Logic Family | — | CMOS (SRAM-based) |
| Embedded Array Blocks (EABs) | — | Yes (for distributed RAM/ROM) |
| Configuration Interface | — | IEEE 1149.1 JTAG |
| MultiVolt I/O | — | Yes (1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) |
| Packaging | — | Bulk / Tray |