EPF10K250EBI600-3 vs EPF10K250EBC600-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBI600-3 sa pamamagitan ng Intel at EPF10K250EBC600-2 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Huling PagbiliAltera
EPF10K250EBC600-2 - FLEX 10KE FPGA 250K Gates 600-BGA | Altera
EPF10K250EBC600-2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K250EBI600-3 | EPF10K250EBC600-2 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | — |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | 4 |
| On-chip RAM | Up to 40 Kbits | — |
| Packhaging | 600-ball BGA (HBGA) | 600-ball FineLine BGA |
| Ball Pitch | 1.93 mm | — |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | — |
| Temperature na Operasyon | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | — |
| Speed Grade | -3 (fastest) | — |
| Process Technology | 0.22 µm CMOS, 4-layer metal | SRAM-based, 0.22 um CMOS |
| Configuration Method | SRAM, requires external configuration device (EPC series) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Not specified (SnPb / tin-lead finish per legacy distributor listing) | — |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Typical Gates | — | 250,000 |
| Usable Gates | — | 152,000 |
| Logic Elements (LEs) | — | 12,288 |
| Flip-Flops | — | 12,288 |
| Logic Array Blocks (LABs) | — | 80 (8 LEs each) |
| Embedded Array Blocks (EABs) | — | 4096 (2,048 bits each) |
| Embedded Memory Bits | — | 40,960 bits |
| Maximum User I/O Pins | — | 488 |
| I/O Banks | — | 12 |
| Core Supply Voltage | — | 3.3 V |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, GTL+, SSTL-2, SSTL-3 |
| Operating Temperature Grade | — | Commercial |
| Configuration Mode | — | PS, PPS, PPA, JTAG |