EPF10K250EBI600-3 vs EPF10K250EFC672-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K250EBI600-3 sa pamamagitan ng Intel at EPF10K250EFC672-3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K250EBI600-3 - 250K Gates FLEX 10KE FPGA, 600-BGA | Intel
EPF10K250EBI600-3 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EPF10K250EBI600-3 | EPF10K250EFC672-3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Logic Elements | 12,160 | — |
| Typical Gate Count | 250,000 system gates | — |
| Embedded System Blocks (ESBs) | 12 | — |
| Maximum User I/O | 470 | — |
| Dedicated Inputs | 4 | — |
| PLLs | 4 | — |
| On-chip RAM | Up to 40 Kbits | — |
| Packhaging | 600-ball BGA (HBGA) | 672-ball FineLine BGA (FC) |
| Ball Pitch | 1.93 mm | 1.0 mm |
| Core Voltage | 2.3 V (FLEX 10KE standard) [DATA_NEEDED: confirm exact VCCINT] | — |
| Temperature na Operasyon | Industrial, 0C to +85C [DATA_NEEDED: confirm -40C to +85C range] | — |
| Speed Grade | -3 (fastest) | -3 (fastest) |
| Process Technology | 0.22 µm CMOS, 4-layer metal | 0.25 um CMOS, 5-layer metal |
| Configuration Method | SRAM, requires external configuration device (EPC series) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Not specified (SnPb / tin-lead finish per legacy distributor listing) | [DATA_NEEDED: RoHS status - 672-FBGA part is non-RoHS per Fly-Wing listing] |
| Lead-free | no (legacy tin-lead per distributor description) | — |
| Product Type | — | FPGA (Field Programmable Gate Array) |
| Maximum Typical Gates | — | 250,000 |
| Logic Elements (LEs) | — | 12,160 |
| Embedded Memory (EAB) | — | 655,360 bits (80 EABs x 2,048 bits each) |
| Logic Array Blocks (LABs) | — | 392 (8 LEs per LAB) |
| User I/O Pins | — | 470 |
| Core Supply Voltage | — | 2.5 V |
| I/O Supply Voltage | — | MultiVolt: 1.5 V / 1.8 V / 2.5 V / 3.3 V |
| Temperature Grade | — | Commercial (0C to +70C) |
| Configuration Mode | — | JTAG (IEEE 1149.1) ISP / serial / parallel, external EPCx PROM |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |