EPF10K30EFC256-3 vs EPF10K30EFC256-3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30EFC256-3 sa pamamagitan ng Intel at EPF10K30EFC256-3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K30EFC256-3 | EPF10K30EFC256-3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE | FLEX 10KE |
| Typical Gates | 30,000 | — |
| Logic Elements / Cells | 1,728 | 1,728 |
| Logic Array Blocks (LABs) | 216 | 216 |
| Embedded RAM Bits | 24,576 | — |
| User I/O Pins | 176 | — |
| Maximum Operating Frequency | 200 MHz | — |
| Process Technology | 0.22 micrometer CMOS | 0.22 um CMOS |
| Core Supply Voltage (VCCINT) | 2.5 V | — |
| I/O Supply Voltage (VCCIO) | 3.3 V (multi-voltage I/O standard support) | — |
| Packhaging | 256-ball FineLine BGA | 256-pin FineLine BGA (FBGA) |
| Uri ng Pagpapasok | Surface Mount (BGA) | — |
| Speed Grade | -3 (fastest) | — |
| Temperature Grade | Commercial | — |
| Configuration Interface | Serial (EPC8/EPC16) and JTAG (IEEE 1149.1) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Gate Count | — | 30,000 gates |
| Embedded Array Blocks (EABs) | — | 6 |
| Embedded RAM | — | 24,576 bits |
| Maximum User I/Os | — | 176 |
| Core Voltage | — | 2.5 V |
| I/O Standard Support | — | MultiVolt 2.5 V / 3.3 V / 5.0 V |
| Internal Frequency | — | 80 MHz (typical) |
| Propagation Delay (tPD) | — | 0.6 ns |
| Bidirectional I/O Performance | — | up to 212 MHz |
| PCI Compliance | — | PCI SIG 2.2 at 33 / 66 MHz |
| Temperature na Operasyon | — | 0 C to +70 C (Commercial) |
| JTAG Support | — | Yes (IEEE 1149.1 boundary-scan) |
| Open-Drain I/O Option | — | Yes (per pin) |