EPF10K30ETI144-3 vs EPF10K50ETI144-2 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K30ETI144-3 sa pamamagitan ng Altera at EPF10K50ETI144-2 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EPF10K50ETI144-2 - 50K Gates FLEX 10KE FPGA, 144-LQFP | Intel
EPF10K50ETI144-2 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EPF10K30ETI144-3 | EPF10K50ETI144-2 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | FLEX-10KE | — |
| Family | FLEX-10KE Embedded Programmable Logic Device | FLEX 10KE |
| Logic Elements | 1728 | — |
| Logic Array Blocks (LABs) | 216 | 360 |
| Embedded RAM | 24,576 bits | — |
| Embedded Array Blocks (EABs) | 6 | 10 |
| Maximum User I/O | 102 | — |
| Maximum Equivalent Gates | 119,000 | — |
| Pin-to-Pin Delay (Speed Grade) | 12.5 ns | — |
| Supply Voltage (Core) | 2.5 V / 3.3 V | — |
| I/O Voltage Tolerance | 5.0 V / 3.3 V / 2.5 V (multi-volt) | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Packhaging | 144-LQFP (LFQFP) | 144-LQFP (TQFP), 22 x 22 mm, 0.5 mm pitch |
| Package Height | 1.6 mm | — |
| Lead Finish | Tin/Lead (Sn/Pb) | — |
| Uri ng Pagpapasok | Surface Mount (Gull Wing) | — |
| Configuration Method | SRAM (volatile) + JTAG IEEE 1149.1 | Serial Passive / JTAG (IEEE 1149.1) |
| Tindminan RoHS | Non-Compliant (Sn/Pb lead finish) | [DATA_NEEDED: RoHS status] |
| Typical Gates | — | 50,000 |
| Maximum System Gates | — | 199,000 |
| Logic Elements (LEs) | — | 2,880 |
| Total RAM Bits | — | 40,960 |
| Maximum User I/O Pins (this package) | — | 102 |
| Maximum User I/O Pins (family) | — | 254 |
| Core Voltage (VCCINT) | — | 2.5 V |
| Process Technology | — | 0.22 µm CMOS SRAM |
| Speed Grade | — | -2 (mid) |