EPF10K50EQC208-3 vs EPF10K50SQC208-3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPF10K50EQC208-3 sa pamamagitan ng Intel at EPF10K50SQC208-3 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPF10K50EQC208-3 | EPF10K50SQC208-3 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | FLEX 10KE (EPF10K50E) | FLEX 10K |
| Typical Gate Count | 50,000 gates | — |
| Logic Elements | 2,880 | — |
| Embedded Memory (EAB) | 40,960 bits | — |
| Logic Array Blocks (LABs) | 360 | 360 |
| User I/Os | 147 | 147 |
| Maximum Internal Frequency | 166.67 MHz | — |
| Propagation Delay | 0.6 ns (per DigChip) | — |
| Core Supply Voltage | 2.3 V to 2.7 V (2.5 V typical) | 2.5 V |
| I/O Supply Voltage | 3.3 V or 5.0 V | — |
| Temperature na Operasyon | 0 °C to +70 °C (Commercial) | 0 °C to 70 °C (Commercial) |
| Packhaging | 208-BFQFP (PQFP), 28 × 28 mm | 208-BFQFP / PQFP (28x28 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (gull wing) |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Configuration Method | SRAM, volatile (requires EPC boot device) | — |
| Process Technology | 0.22 µm CMOS, SRAM-based | 0.22 µm CMOS |
| Katayuan ng Lifecycle | Obsolete (per Rocelec / Altera PCN history) | — |
| Series | — | FLEX-10KS |
| Typical Gates | — | 50,000 |
| Logic Cells / Elements | — | 2,880 |
| Embedded Memory (Bits) | — | 40,960 |
| Internal Frequency (max) | — | 166.67 MHz |
| Propagation Delay (typ) | — | 0.6 ns |
| Configuration Technology | — | SRAM-based, reprogrammable |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS status] |