EPM2210GF324C4N vs EPM2210GF324I5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM2210GF324C4N sa pamamagitan ng Intel at EPM2210GF324I5 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EPM2210GF324I5 - 2210 LE MAX II CPLD, 212 I/O, FBGA-324 | Altera / Intel
EPM2210GF324I5 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EPM2210GF324C4N | EPM2210GF324I5 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 2,210 | — |
| Equivalent Macrocells | 1,700 | 1,700 |
| User I/Os (max) | 272 | 272 |
| User Flash Memory (UFM) | 8 Kbits | 8 Kbits |
| Supply Voltage - Core (VCCINT) | 1.8 V | — |
| MultiVolt I/O Support | 1.5 V / 1.8 V / 2.5 V / 3.3 V / 5.0 V | — |
| Maximum Internal Frequency | 247.5 MHz | — |
| Pin-to-Pin Logic Delay (tPD) | 7.0 ns (C4 speed grade) | — |
| Process Technology | 0.18 µm 6-layer-metal flash | 0.18 µm 6-layer-metal flash CMOS |
| Packhaging | 324-ball FineLine BGA (GF324) | FBGA-324 (FineLine BGA, 19 x 19 mm, 1.0 mm pitch) |
| Programming Interface | IEEE 1149.1 JTAG (ISP) | JTAG (IEEE 1149.1) / ISP |
| Operating Temperature (commercial) | 0 °C to +85 °C | — |
| Tindminan RoHS | Compliant | Compliant (Pb-free) |
| Logic Elements (LEs) | — | 2,210 |
| Propagation Delay (tPD1, max) | — | 7 ns (industrial speed grade I5) |
| Core Supply Voltage (VCCINT) | — | 1.8 V |
| I/O Supply Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| Temperature na Operasyon | — | -40 °C to +100 °C (industrial grade, suffix I) |
| Uri ng Pagpapasok | — | Surface Mount |