EPM240GF100C5N vs EPM240GF100I5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EPM240GF100C5N sa pamamagitan ng Intel at EPM240GF100I5N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EPM240GF100C5N | EPM240GF100I5N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | MAX II | — |
| Logic Elements / Macro Cells | 192 macro cells | — |
| Pin-to-Pin Logic Delay (tPD) | 4.7 ns | — |
| Maximum Operating Frequency | 201.1 MHz | — |
| User I/Os | 80 | — |
| Logic Family | CMOS | CMOS |
| Process Technology | 0.18 um | — |
| Core Supply Voltage (VCCINT) | 1.8 V | — |
| I/O Supply Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V | 1.5 V / 1.8 V / 2.5 V / 3.3 V (MultiVolt) |
| User Flash Memory | 8 Kbits | — |
| Packhaging | 100-ball FBGA (11 x 11 mm, 1.0 mm pitch) | 100-ball FBGA (FineLine BGA), 11 mm x 11 mm, 1.0 mm pitch |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 C to +125 C | — |
| Programming Interface | JTAG (IEEE 1149.1) / Jam STAPL | — |
| Configuration Memory | On-chip non-volatile Flash | — |
| Tindminan RoHS | Lead Free, RoHS compliant | — |
| Series | — | MAX II |
| Logic Elements / Blocks | — | 240 LE |
| Number of Macrocells | — | 192 |
| Maximum User I/O | — | 80 |
| Propagation Delay (tpd, max) | — | 4.7 ns |
| Programmable Type | — | In-System Programmable (ISP) |
| Non-Volatile Memory | — | On-chip flash configuration |
| Internal Supply Voltage | — | 1.71 V to 1.89 V (regulated on-chip) |
| Operating Temperature (TJ) | — | -40 C to +100 C |
| JTAG Support | — | IEEE 1149.1 / IEEE 1532 compliant |
| Lead-Free / RoHS | — | Yes (lead-free, RoHS compliant) |
| Vertical Migration Family | — | EPM240 / EPM570 / EPM1270 / EPM2210 in same-package footprint |