K4AAG085WA-BCPB vs K4AAG085WM-BCRC Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng K4AAG085WA-BCPB sa pamamagitan ng Samsung Electronics at K4AAG085WM-BCRC sa pamamagitan ng Samsung Electronics. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | K4AAG085WA-BCPB | K4AAG085WM-BCRC |
|---|---|---|
| Brand | Samsung Electronics | Samsung Electronics |
| Kategorya | Memory ICs | Memory ICs |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Uri ng Memory | DDR4 SDRAM | DDR4 SDRAM |
| Density | 16 Gbit | [DATA_NEEDED: exact density in Gb] |
| Organisasyon | 2G x 8 | x8 |
| Volte ng Pagbibigay | 1.2 V | — |
| Speed Grade | [DATA_NEEDED: speed grade Mbps for BCPB suffix] | — |
| Packhaging | 78FBGA | 78-ball FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | 0 C to 85 C (commercial grade, per K4AAG085WA family data) | [DATA_NEEDED: operating temperature range] |
| Interface | Parallel (DDR4) | SSTL12 |
| Clock Type | Synchronous, differential clock | — |
| Bank Architecture | DDR4 bank group architecture | — |
| DLL Mode | DLL Enabled mode operation (per Samsung datasheet abstract) | — |
| Memory Format | DRAM | — |
| Tindminan RoHS | Compliant (per family listing on JLCPCB) | [DATA_NEEDED: RoHS status] |
| Temperature Grade Code | C (per Samsung part number coding) | — |
| Speed Bin Code | PB (per Samsung part number coding) | — |
| Supply Voltage (VDD) | — | 1.2 V |
| I/O Voltage (VDDQ) | — | 1.2 V |
| Max Data Rate | — | Up to 3200 Mbps/pin (family max per Samsung DDR4 page) |
| Architecture | — | Bank-group DDR4 |
| Termination | — | On-Die Termination (ODT) |
| Latensya ng CAS | — | [DATA_NEEDED: CL of -BCRC speed grade] |
| Clock | — | Differential clock CK/CK# |
| Level ng MSL | — | [DATA_NEEDED: moisture sensitivity level] |