M1AFS250-2FG256I vs M1AFS250-1FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS250-2FG256I sa pamamagitan ng Microchip Technology at M1AFS250-1FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS250-2FG256I - 250K Gate Fusion FPGA, ARM M1 | Microchip
M1AFS250-2FG256I ✓ NakahandaMicrochip Technology
M1AFS250-1FG256I - 250K Gate Fusion FPGA, 114 I/O | Microchip
M1AFS250-1FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS250-2FG256I | M1AFS250-1FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion (M1AFS, ARM Cortex-M1 support) | — |
| System Gates | 250K | 250000 gates |
| User I/O | 114 | — |
| Embedded RAM Bits | 36864 | — |
| Core Supply Voltage | 1.5 V | 1.5 V (1.425 V to 1.575 V) |
| Process Technology | 130 nm, 7-layer metal flash-based CMOS | — |
| System Performance | 350 MHz | — |
| Processor Core | ARM Cortex-M1 (hard IP) | — |
| Configuration Memory | Flash-based, nonvolatile | — |
| Power-Up Mode | Live at Power-Up (LAPU) | — |
| Analog Block | Configurable analog (voltage, current, temperature monitoring) | — |
| Packhaging | 256-ball FBGA (256-LBGA) | 256-LBGA (FBGA) |
| Speed Grade | -2 | -1 |
| Temperature Range | Industrial (-40C to +85C) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | RoHS Non-Compliant (contains lead; FGG variant is lead-free) | — |
| Packaging | Tray | — |
| Series | — | Fusion (M1 - with ARM Cortex-M1) |
| D Flip-Flops (DFF) | — | 36864 |
| Total I/O | — | 114 |
| Configuration Type | — | Flash-based (live at power-up) |
| Embedded Processor | — | ARM Cortex-M1 soft core |
| Analog Features | — | Configurable analog blocks, clock generation and management |
| On-chip Memory | — | Flash memory blocks |
| Temperature na Operasyon | — | -40C to +85C (industrial, suffix I) |
| Package Dimensions | — | 17 mm x 17 mm x 1.2 mm height |
| Supplier Device Package | — | 256-LBGA |
| Total RAM | — | [DATA_NEEDED: Total RAM bits] |
| Embedded Block RAM (eSRAM) | — | [DATA_NEEDED: eSRAM size] |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |