M1AFS600-1FGG256 vs M1AFS250-1FGG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M1AFS600-1FGG256 sa pamamagitan ng Microchip Technology at M1AFS250-1FGG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M1AFS600-1FGG256 - Fusion FPGA, Cortex-M1, 600K Gates | Microchip
M1AFS600-1FGG256 ✓ NakahandaMicrochip Technology
M1AFS250-1FGG256I - 250K Gate Flash FPGA 256-FBGA | Microchip
M1AFS250-1FGG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M1AFS600-1FGG256 | M1AFS250-1FGG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Fusion Mixed-Signal FPGA | — |
| Processor Core | ARM Cortex-M1 (hard core) | ARM Cortex-M1 (optional ARM support, M1 variant) |
| System Gates | 600000 | 250,000 gates |
| Configurable Logic Blocks (CLBs) | 13824 | — |
| Flip-Flops | 110592 | — |
| User I/O | 119 | — |
| Core Supply Voltage | 1.5 V | — |
| Process Technology | 130 nm CMOS, flash-based | — |
| Configuration Memory | Flash (non-volatile, live at power-up) | Nonvolatile flash (Live at Power-Up, LAPU) |
| Temperature na Operasyon | 0C to +85C | — |
| Packhaging | 256-ball LBGA (FGG256), 17x17x1.7 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Analog Features | Configurable analog blocks, clock generation and management | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Packaging | Tray | Tray |
| Series | — | M1AFS250 (Fusion) |
| Logic Cells | — | 6144 |
| Total SRAM/Flip-Flop Bits (DigiKey listing) | — | 36864 |
| Number of I/O | — | 114 |
| Maximum System Frequency | — | 350 MHz |
| Technology | — | 130-nm, 7-layer metal, flash-based CMOS |
| Security | — | 128-bit flash-based lock, AES decryption |
| Supply Voltage na Operasyon | — | 1.5 V |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Packhaging / Kaso | — | 256-LBGA (FBGA), 1.00 mm ball pitch |
| Style ng Pagpapasok | — | SMD/SMT |
| Mixed-Signal Features | — | Configurable analog, flash memory blocks, clock generation and management |
| Moisture Sensitivity Level | — | [DATA_NEEDED: MSL level] |