M7AFS600-FG256 vs M7AFS600-FG256I Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng M7AFS600-FG256 sa pamamagitan ng Microchip Technology at M7AFS600-FG256I sa pamamagitan ng Microchip Technology. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Microchip Technology
M7AFS600-FG256 - Fusion FPGA 600K Gates, 119 I/O | Microchip
M7AFS600-FG256 ✓ NakahandaMicrochip Technology
M7AFS600-FG256I - 600K Gate Mixed-Signal FPGA | Microchip
M7AFS600-FG256I ✓ NakahandaPagsanggunian na paghahambing
| Parametro | M7AFS600-FG256 | M7AFS600-FG256I |
|---|---|---|
| Brand | Microchip Technology | Microchip Technology |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | M7AFS600 (Fusion) | M7AFS600 (Fusion) |
| System Gates | 600000 gates | 600K |
| D Flip-Flops / Registers | 110592 | — |
| User I/O | 119 | — |
| Embedded Processor | ARM CoreMP7 | ARM CoreMP7 |
| Core Supply Voltage | 1.5 V | 1.5 V |
| Process Technology | 130 nm Flash | 130 nm |
| Configuration Type | Flash-based, non-volatile | — |
| Maximum Operating Frequency | 1098.9 MHz (per FPGAkey listing) | — |
| Packhaging / Kaso | 256-LBGA (FBGA), 17x17x1.7 mm | 256-LBGA (FBGA) |
| Terminal Form | Ball (SMD/SMT) | Ball |
| Temperature na Operasyon | 0 C to +70 C (commercial) | — |
| Style ng Pagpapasok | Surface Mount | SMD/SMT |
| Packaging | Tray | Tray |
| Tindminan RoHS | Compliant | — |
| Product Type | Mixed-Signal FPGA | — |
| Logic Capacity (DigiKey listing) | — | 110592 |
| Number of I/O | — | 119 I/O |
| Package Shape | — | Square |
| Minimum Operating Temperature | — | -40 C |
| Maximum Operating Temperature | — | +85 C |
| Programmable Logic Type | — | Flash-based, non-volatile |
| Analog Integration | — | Mixed-signal (configurable analog + flash memory) |