MC9S08DZ48ACLF vs MC9S08DZ60ACLF Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S08DZ48ACLF sa pamamagitan ng NXP Semiconductors at MC9S08DZ60ACLF sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MC9S08DZ48ACLF - 8-bit S08 MCU, 48KB Flash, CAN, 48-LQFP | NXP
MC9S08DZ48ACLF NrndNXP Semiconductors
MC9S08DZ60ACLF - 8-bit S08 MCU, 60KB Flash, CAN/LIN, 48-LQFP | NXP
MC9S08DZ60ACLF NrndPagsanggunian na paghahambing
| Parametro | MC9S08DZ48ACLF | MC9S08DZ60ACLF |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core Processor | HCS08 (S08) | — |
| Core Size | 8-bit | — |
| Core Speed | 40 MHz (20 MHz bus) | — |
| Program Memory Size | 48 KB (48K x 8) Flash | — |
| RAM Size | 3 KB | — |
| EEPROM Size | 1.5 KB | — |
| Number of I/O | 39 | — |
| Volte ng Pagbibigay | 2.7 V to 5.5 V | — |
| Temperature na Operasyon | -40 C to +85 C | -40C to +85C (industrial) [DATA_NEEDED: AEC-Q100 grade range] |
| Packhaging | 48-LQFP (7 mm x 7 mm) | 48-LQFP (7x7 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Connectivity | CANbus, I2C, LINbus, SCI, SPI | — |
| Peripherals | LVD, POR, PWM, WDT | — |
| A/D Channels | Up to 16 channels, 10/12-bit | — |
| LCD Driver | Yes (integrated) | Yes (on-chip segment LCD driver) |
| MSCAN (CAN 2.0A/B) | Yes | — |
| Tindminan RoHS | Compliant | Compliant |
| Core | — | HCS08 (8-bit CISC) |
| Core Frequency | — | 40 MHz (20 MHz bus) |
| Program Memory (Flash) | — | 60 KB (60K x 8) |
| RAM | — | 4 KB |
| EEPROM / Emulated EEPROM | — | Available (size [DATA_NEEDED: EEPROM size]) |
| Operating Voltage | — | 2.7 V to 5.5 V |
| Supply Rails | — | 3.3 V / 5 V |
| ADC | — | 24-channel, 12-bit, 2.5 us conversion |
| CAN | — | 1 x CAN 2.0 A/B |
| LIN | — | Master LIN 2.0 interface |
| Communication Peripherals | — | SCI (SPI), IIC, MSCAN |
| Timer / PWM Channels | — | Multiple (count [DATA_NEEDED: timer/PWM channel count]) |
| Level ng MSL | — | MSL 3 (per JEDEC J-STD-020) |
| Background Debug Mode (BGND) | — | Yes (on-chip emulation/debug) |
| Instruction Set | — | HC08 instruction set with added BGND instruction |