MC9S12D32CFUE vs MC9S12D64CFUE Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MC9S12D32CFUE sa pamamagitan ng NXP Semiconductors at MC9S12D64CFUE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | MC9S12D32CFUE | MC9S12D64CFUE |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | HCS12 (16-bit CISC) | HCS12 (16-bit CISC) |
| Family | S12D sub-family | — |
| Program Memory | 32 KB Flash | — |
| RAM | 2 KB | 4 KB |
| EEPROM | 1 KB | 1 KB |
| Maximum CPU Frequency | 25 MHz | 25 MHz |
| Volte ng Pagbibigay | 2.5 V / 5 V | 2.5 V / 5 V |
| ADC | 8-channel, 10-bit | 8-channel, 10-bit |
| PWM Channels | 8 | — |
| CAN | 1 x CAN 2.0 | — |
| SCI (UART) | 2 | — |
| SPI | 1 | — |
| I2C | 1 | — |
| Packhaging | 80-QFP (14x14 mm) | 80-QFP (14 x 14 mm) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +85C | [DATA_NEEDED: operating temperature range] |
| Debug Interface | Single-wire BDM (Background Debug Mode) | — |
| Program Memory (Flash) | — | 64 KB (64K x 8) |
| Number of I/O | — | 59 |
| Communication Peripherals | — | 2x SCI (UART), SPI, I2C, MSCAN (CAN 2.0A/B) |
| Timers | — | ECT, TIM, PWM, PIT |
| Tindminan RoHS | — | [DATA_NEEDED: RoHS compliance status] |
| Packaging | — | Tray |