MCF5275CVM166 vs MCF5274LCVM166 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MCF5275CVM166 sa pamamagitan ng NXP Semiconductors at MCF5274LCVM166 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MCF5275CVM166 - ColdFire V2 32-bit MPU, 166MHz, 256-MAPBGA | NXP
MCF5275CVM166 NrndNXP Semiconductors
MCF5274LCVM166 - 32-Bit ColdFire V2 MPU 166MHz LBGA-196 | NXP
MCF5274LCVM166 NrndPagsanggunian na paghahambing
| Parametro | MCF5275CVM166 | MCF5274LCVM166 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | NRND | NRND |
| Core | ColdFire V2 (32-bit) | ColdFire V2 (MCF527x family) |
| Maksimum na Taktiko ng Oras | 166 MHz | — |
| On-Chip SRAM | 64 KB | — |
| Program Memory Size | ROMless | — |
| Program Memory Type | External (ROMless) | — |
| Packhaging | 256-MAPBGA (17x17 mm) | 196-LBGA (15x15 mm) |
| Number of I/O Lines | 69 | — |
| Connectivity | EBI/EMI, Ethernet, I2C, SPI (QSPI), UART/USART, USB | — |
| Ethernet | Dual 10/100 MAC | 10/100 Fast Ethernet MAC (integrated PHY on selected family members) |
| USB | USB 1.1 device/host | USB 2.0 Full-Speed Device/Host (integrated PHY on selected family members) |
| CAN | 2x CAN 2.0B | — |
| Peripherals | DMA, WDT, timers, hardware crypto (DES/3DES/AES/SHA) | — |
| Supply Voltage Core | 1.5 V | — |
| Supply Voltage I/O | 3.3 V | — |
| Temperature na Operasyon | -40C to +85C (industrial) | [DATA_NEEDED: exact operating temperature range] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant (per distributor listing) |
| Core Architecture | — | 32-bit RISC (ColdFire) |
| Maximum Core Frequency | — | 166 MHz |
| Core Supply Voltage | — | 1.5 V |
| I/O Supply Voltage | — | 3.3 V |
| Program Memory | — | ROMless (external boot) |
| RAM | — | [DATA_NEEDED: internal SRAM size] |
| Temperature Grade | — | Industrial |
| Cryptography | — | Hardware crypto accelerator (DES / 3DES / AES / SHA-1) |
| External Memory Bus | — | SDRAM / SRAM / ROM controller |
| DMA Channels | — | [DATA_NEEDED: number of DMA channels] |
| Serial Peripherals | — | UART, I2C, QSPI |