MPC8321CVRADDC vs MPC8321CVRAFDCA557 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPC8321CVRADDC sa pamamagitan ng NXP Semiconductors at MPC8321CVRAFDCA557 sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ NakahandaNXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPC8321CVRADDC | MPC8321CVRAFDCA557 |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Microcontrollers | Microcontrollers |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xxx / MPC83xx | — |
| Core | PowerPC e300c2 | e300c2 (MPC603e-based) PowerPC |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 |
| Process Technology | 90 nm CMOS | — |
| Volte ng Pagbibigay | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | 516-ball TEBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 27 mm x 27 mm | — |
| Hanay ng Temperature na Operasyon | -40C to +105C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM | — |
| Integrated Peripherals | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | — |
| Encryption / SEC Block | Not included (non-E variant) | — |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Frequency | — | 333 MHz |
| Core Voltage | — | 950 mV to 1.05 V |
| I/O Voltage | — | 3.0 V to 3.6 V |
| Temperature na Operasyon | — | -40 °C to +105 °C |
| Packhaging | — | 516-PBGA (27x27 mm) |
| Memory Controller | — | DDR1 / DDR2 (16-bit ECC supported) |
| Integrated Peripheral Set | — | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine |
| Ethernet | — | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) |
| Family Prefix (suffix decoding) | — | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask |
| Compliance | — | RoHS - check suffix code |
| Lead-Free / Pb-Free | — | Suffix-dependent (557/AFD variants lead-free) |
| MSL / Reflow | — | BGA-specific, per JEDEC J-STD-020 |