MPC8321CVRADDC vs MPC8321CVRAFDCA557 对比
详细并排对比 MPC8321CVRADDC 出自 NXP Semiconductors 和 MPC8321CVRAFDCA557 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC8321CVRADDC - 266MHz PowerQUICC II Pro MPU, 516-PBGA | NXP
MPC8321CVRADDC ✓ 量产中NXP Semiconductors
MPC8321CVRAFDCA557 - 333MHz PowerQUICC II Pro MPU | NXP | 516-PBGA
MPC8321CVRAFDCA557 ✓ 量产中规格对比
| 参数 | MPC8321CVRADDC | MPC8321CVRAFDCA557 |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 有效 | 有效 |
| Manufacturer | NXP Semiconductors (formerly Freescale) | NXP Semiconductors (formerly Freescale) |
| Product Category | Microprocessors (MPU) | — |
| Processor Series | MPC8xxx / MPC83xx | — |
| Core | PowerPC e300c2 | e300c2 (MPC603e-based) PowerPC |
| Core Architecture | 32-bit Power Architecture | 32-bit Power Architecture |
| Core Clock Speed | 266 MHz | — |
| Number of Cores | 1 | 1 |
| Process Technology | 90 nm CMOS | — |
| 电源电压 | 1.8 V / 2.5 V / 3.3 V | — |
| Package Type | 516-ball TEBGA (Plastic Ball Grid Array) | — |
| Package Dimensions | 27 mm x 27 mm | — |
| 工作温度范围 | -40C to +105C | — |
| Integrated Memory Controller | DDR1 / DDR2 SDRAM | — |
| Integrated Peripherals | QUICC Engine, PCI, USB 2.0, UART, I2C, GPIO, TDM/HDLC | — |
| 安装类型 | Surface Mount | Surface Mount |
| RoHS 状态 | [DATA_NEEDED: RoHS compliance status] | — |
| Encryption / SEC Block | Not included (non-E variant) | — |
| Series | — | PowerQUICC II Pro, MPC83xx |
| Core Frequency | — | 333 MHz |
| Core Voltage | — | 950 mV to 1.05 V |
| I/O Voltage | — | 3.0 V to 3.6 V |
| 工作温度 | — | -40 °C to +105 °C |
| 封装 | — | 516-PBGA (27x27 mm) |
| Memory Controller | — | DDR1 / DDR2 (16-bit ECC supported) |
| Integrated Peripheral Set | — | PCI 2.3, USB 2.0 (Host/Device), 8x UART, QUICC Engine, Security Engine |
| Ethernet | — | QUICC Engine (multi-protocol: Ethernet, HDLC, ATM) |
| Family Prefix (suffix decoding) | — | CVR = standard; AFD = 333 MHz / 0F lead-free; CA = 516-PBGA; 557 = specific die/firmware mask |
| Compliance | — | RoHS - check suffix code |
| Lead-Free / Pb-Free | — | Suffix-dependent (557/AFD variants lead-free) |
| MSL / Reflow | — | BGA-specific, per JEDEC J-STD-020 |