MPC8572ELVTAVND vs MPC8572VTAVNE Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng MPC8572ELVTAVND sa pamamagitan ng NXP Semiconductors at MPC8572VTAVNE sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

NXP Semiconductors
MPC8572ELVTAVND MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP

MPC8572ELVTAVND - PowerQUICC III 1.5GHz Dual-Core MPU | NXP

MPC8572ELVTAVND ✓ Nakahanda
NXP Semiconductors
MPC8572VTAVNE MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE - PowerPC e500 Dual-Core 1.5GHz SoC | NXP | FCBGA-1023

MPC8572VTAVNE ✓ Nakahanda

Pagsanggunian na paghahambing

Parametro MPC8572ELVTAVND MPC8572VTAVNE
Brand NXP Semiconductors NXP Semiconductors
Kategorya Microcontrollers Microcontrollers
Katayuan ng Lifecycle Aktibo Aktibo
Manufacturer NXP USA Inc. (formerly Freescale) NXP Semiconductors (formerly Freescale)
Part Family PowerQUICC III MPC85xx —
Core Architecture PowerPC e500, dual-core PowerPC e500 (Book E, with SPE/APU)
Width ng Data Bus 32-bit —
Maximum Clock Speed 1.5 GHz —
Operating Voltage 1.8 V / 2.5 V / 3.3 V —
Process Technology 0.09 um (90 nm) CMOS —
Packhaging / Kaso 1023-FCBGA (33x33 mm) —
L2 Cache 1 MB shared 1 MB (shared)
L1 Cache (per core) 32 KB I-cache + 32 KB D-cache —
Memory Controller Dual DDR2 with ECC DDR2 / DDR3 with ECC
Ethernet 4x GbE (SGMII/RGMII) + 2x TSEC —
High-Speed I/O PCI Express x8, Serial RapidIO —
Security Engine AES, DES, 3DES, Kasumi, SHA-1/256 Integrated
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Temperature na Operasyon 0C to +85C (commercial) —
Compliance RoHS status [DATA_NEEDED: rohs status] —
Number of Cores — 2
Core Clock Frequency (max) — 1.5 GHz
Hanay ng Temperature na Operasyon — 0 C to +105 C
Core Voltage — 1.1 V
PCI Express — 3 x PCIe interfaces
Ethernet MAC — 2 x 10/100/1000 Mbps (Triple Speed)
Serial RapidIO — Yes
Packhaging — 1023-ball FCBGA, 33 mm x 33 mm
Level ng MSL — [DATA_NEEDED: MSL classification]
Tindminan RoHS — compliant
Product Family — PowerQUICC III (MPC85xx)
Process Node — [DATA_NEEDED: fabrication process]

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