MPXV7025DPT1 vs MPXV7025DP Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng MPXV7025DPT1 sa pamamagitan ng NXP Semiconductors at MPXV7025DP sa pamamagitan ng NXP Semiconductors. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
NXP Semiconductors
MPXV7025DPT1 - ±25 kPa Differential Pressure Sensor | NXP
MPXV7025DPT1 ✓ NakahandaNXP Semiconductors
MPXV7025DP - 5V ±25kPa Differential Pressure Sensor | NXP/ST
MPXV7025DP ✓ NakahandaPagsanggunian na paghahambing
| Parametro | MPXV7025DPT1 | MPXV7025DP |
|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors |
| Kategorya | Pressure Sensors | Pressure Sensors |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Operating Pressure | ±3.63 PSI (±25 kPa) | — |
| Pressure Type | Differential | Differential (Dual Port) |
| Type ng Output | Analog Voltage (ratiometric) | Analog voltage, ratiometric |
| Hanay ng Output Volte | 0.2 V to 4.7 V | 0.2 V to 4.7 V |
| Volte ng Pagbibigay | 5.0 V typical | 5 V DC nominal |
| Sensitivity | Approximately 90 mV/kPa | ~90 mV/kPa (at 5 V supply) |
| Port Size | Male, 0.13 in (3.302 mm) tube, dual | — |
| Port Style | Dual ports, same side | Dual ports, same side, male 0.13" (3.3 mm) tube |
| Packhaging / Kaso | 8-BSOP (0.475 in / 12.06 mm width) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40 °C to +125 °C | 0 °C to +85 °C |
| Type ng Sensor | Piezoresistive (MEMS silicon) | — |
| On-Chip Signal Conditioning | Yes (calibrated and temperature-compensated) | — |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Pressure Range | — | -25 kPa to +25 kPa (-3.63 PSI) |
| Operating Pressure Max | — | ±25 kPa |
| Linearity | — | ±5 % (over primary range) |
| Storage Temperature | — | -30 °C to +100 °C (per datasheet range) |
| Packhaging | — | 8-BSOP (SOP-8, 12.06 mm width), surface mount |
| Signal Conditioning | — | On-chip, calibrated and temperature compensated |